isoPower FAQ: The creepage is smaller on the new isoPower devices than the other isoPower products in the SOIC_W package.  Will this limit me?

Document created by rdowning on Mar 25, 2013
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The ADuM5x1x and ADum6x1x mold compounds are qualified as material Group II allowing smaller creepage for the same working voltage.  The SSOP20 packge with 5.3mm of creepage will be adequate for reinforced insulation to 380Vrms just like the SOIC16 parts.