FAQ: Tips for soldering a LFCSP (QFN) package for a prototype

Document created by LucaV Employee on Aug 8, 2012Last modified by LucaV Employee on Aug 8, 2012
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Apart from pre-warming this part at 125 degrees for 24 hours  to remove any moisture does anyone have any recommendations to solder this chip onto a board ?

 

I have allowed a 3 mm plated through hole to allow soldering onto the E-pad but the amount of copper available to solder the pads using a mini flow tip is limited. Should I use solder paste because that may risk shorting beneath the component ?

 

The case conforms to a JEDEC  MO-220WHHD

 

regards

david

 

David,

 

we typically try to put some solder on the pad and use flux to keep the IC in place while heating it with a hot air heat gun.

 

Attached is a quick write up on it we typically send out with our ADIsimPower Blank boards.

 

LucaV

 

LucaV wrote:

 

David,

 

we typically try to put some solder on the pad and use flux to keep the IC in place while heating it with a hot air heat gun.

 

Attached is a quick write up on it we typically send out with our ADIsimPower Blank boards.

 

LucaV

 

Hello Luca

 

Thanks for the doc. Are the via's in the ground pad connected to the ground plane through direct connection or by thermal relief ?

 

I have found a few good videos on soldering QFN's.

 

http://www.youtube.com/topic/hQW0dV3s3K8/quad-flat-no-leads-package?feature=relchannel

 

regards

david

 

This FAQ was generated from the following discussion: Tips for soldering a ADP2323 for a prototype

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