HMC451 pHEMT process

Document created by jdobler Employee on Mar 20, 2017
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Hello,

 

Could you please advise me about the process of HMC451? Is it 0.15um, 0.25um or 0.5um? Or is it same as HMC462?

 

 

Best regards,

Akira


Hi AkiraO,

 

The HMC451 and HMC462 are fabricated on the same process, PHEMT-F.

Below is a link to the Semiconductor Qualification Test Report for this process:

 

http://www.analog.com/media/en/quality/hmc-qtr/QTR_2013-00269.pdf

 

You will find the two part numbers listed in the report.

 

For the HMC-branded products, process geometries are generally considered to be proprietary information and thus we seldom disclose them. Is there a particular reason why you have requested that information? With an understanding of why, I might be able to better help address your concerns.

 

Regards,

SMcBride


Hi,

 

Thank you for your advice. I would like to know if HMC451 is affected by hydrogen as with HMC462.

Should I directly conntact to ADI for like this question?

 

Thanks & Regards,

Akira


Hi Akira,

 

As general advice, our products fabricated in PHEMT processes will contain platinum and/or palladium and, when devices containing such metals are packaged in a sufficiently hermetic manner ("hermetic"), they can become susceptible to the effects of hydrogen poisoning...sometimes seen as gain and bias currents that shift over time, among other effects or failures. Customers who use these types of devices in hermetic packages might thus need to take action to prevent such poisoning. Though mitigation of the effects of hydrogen poisoning is the customer’s responsibility and is not one of our areas of expertise, I’ve been told that the following are some commonly employed techniques:

 

  • Use of hydrogen getter material within the hermetic package
  • Performance of high temperature bake prior to the sealing of the package (to bake away any poisoning that may have already occurred)
  • Sealing of the package within a dry Nitrogen environment (to purge it of hydrogen)
  • Note: I have also heard that hydrogen outgassing within hermetic packages can contribute to the problem, limiting the effectiveness of any baking and purging assembly steps

 

Again, mitigation of the effects of hydrogen poisoning is not one of our areas of expertise, so I offer the above without warranty and only as a courtesy. A search of literature published by independent, academic, and/or government laboratories might help you to find specific methods and procedures that are compatible with your application and assembly processes.

 

I'm one of the ADI EZ support contacts who works most closely to (in) this RF/Microwave product line and would thus likely have access to the most relevant information. You could direct the same questions through other ADI channels, but I don't know that doing so would result in more detailed or insightful answers on this topic.

 

I hope that helps. Let me know if you have more questions. 

 

Regards,

SMcBride


Hi,

 

Thank you for answering my question. I appreciated very much.

 

 

Thanks & Regards,

Akira


This document was generated from the following discussion: HMC451 pHEMT process

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