3DR Computing Overview
3DR Computing technology brings together high-performance computing, ease of programmability, low cost, and commercial I/O flexibility in a modular, open systems and standards architecture to realize uniquely scalable and widely configurable, high-speed embedded processing solutions for the development of radar, EW, SIGINT, and communication systems.
3DR Computing possesses the unique ability to morph in size, shape, and processing capacity. This flexibility provides a low-cost, standard solution capable of rapidly conforming to the vastly different power, space, and environmental requirements found aboard any surface, sub-surface, or airborne system or platform.
2 Channel, 16 Bit, 250MHz Digital-to-Analog Converter
The 3DR-V6-DAC-1GSPS is a two channel, 16 bit, 250Mhz Digital-to-Analog Converter board used to convert digital signals into analog waveforms. Each channel drives two SMAs. The on-board Virtex-6 FPGA (SC6VLX240T) can be used to digitally generate waveforms or playback pre-stored samples.
As with all 3DR Computing modules, the 3DR-V6-DAC-1GSPS supports three-dimensional connectivity, allowing the user to stack and/or tile modules to address a wide variety of processing, I/O, size, weight, and power requirements. The 3DR-V6-DAC-1GSPS also offers additional external interface via TwinAx, SMA, and ribbon cable connections for tailored clocking and control signal flexibility.
The 3DR Computing standard microcontroller architecture is interfaced through the I2C bus to provide FPGA temperature, voltage, and current monitoring for automatic shut-down during critical overheat and/or voltage conditions.
- General Purpose/Digital Signal Processing
- Radar Exciters and Digital Waveform Generation (DWG)
- Electronic Warfare/Attack Systems
- SIGINT (ELINT, COMINT, Etc.) Systems
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