ADUM5010, ADUM6010 - Creepage

Document created by analog-archivist Employee on Feb 23, 2016
Version 1Show Document
  • View in full screen mode

The creepage is smaller on this device than the SOIC wide devices, will this
limit me?


The ADuM5x1x and ADum6x1x mold compounds are qualified as material Group II
allowing smaller creepage for the same working voltage. The SSOP20 packge with
5.3mm of creepage will be adequate for reinforced insulation to 380Vrms just
like the SOIC16 parts.