ADA4922-1: When soldering exposed pad, which plane potential should used?

Document created by analog-archivist Employee on Feb 23, 2016
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The datasheet states that the exposed paddle on the underside of the package
must be soldered to a pad on the PCB surface that is thermally connected to a
copper plane to achieve the specified θJA. The datasheet does not specify the
potential of the copper plane. Can you confirm this please?

 

The paddle has to be soldered to a heat sinking plane only for thermal/heat
dissapation reasons. As there is no electrical connection between the paddle
and the IC itself, a ground connection or other plane connection is fine.

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