AD9277 in die form?

Document created by analog-archivist Employee on Feb 23, 2016
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We would like to use AD9277 for a new design, an ultrasonic test equipment for
material testing. High integration level and space saving are important aspects
therefore the preferred component would be AD9277 in bare die (if available),
however we also considered AD9252 + AD8334 (ADC+VGA). The yearly consumption
will be 1000-5000 pcs for the first two years.


The AD9277 is not available in die form. Are you just looking for bare die or
Known Good Die (KGD)? KGD devices require additional manufacturing steps that
tests each individual die after the wafer has been diced. Bare die sales do not
have this additional screening but as a result, you would absorb any yield loss
from die that were damaged in the slicing & dicing process. There is
development costs associated with both options, with KGD being more
substantial. A business case would need to be assembled to warrant the
development investment. So we have the capability to do this form a technical
stand point, but there would have to be a significant business justification
required to start the project. I am not sure that 5kpcs would be enough to kick
this off.