FAQ: Is there information available on proper soldering and assembly techniques for thermally enhanced packages?

Document created by KennyG Employee on Mar 24, 2010Last modified by KennyG Employee on Mar 26, 2010
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Q.

Is there information available on proper soldering and PCB assembly techniques for thermally enhanced packages?

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A.

Yes, see ADI application note AN-772, "A Design and Manufacturing Guide for the LFCSP". Information is also available on the website of the package manufacturer (Amkor Technology: www.amkor.com). Look for: "Application Notes For Surface Mount Assembly of Amkor's Thermally / Electrically Enhanced Leadframe Based Packages."

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