FAQ: Are there any specific recommendations regarding via fill material in the circuit board for the thermally enhanced package styles associated with some ADI DDSs?

Document created by KennyG Employee on Mar 19, 2010Last modified by KennyG Employee on Mar 26, 2010
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Q.

Are there any specific recommendations regarding via fill material in the circuit board for the thermally enhanced package styles associated with some ADI DDSs?

 

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A.

The vias must be through-plated with solder as the fill material (solder is much less expensive than silver-over-copper plate).

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