AD664BD-BIP_Junction-to-Ambient Thermal Resistance

Document created by analog-archivist Employee on Feb 23, 2016
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I would like to know the Junction-to-Ambient Thermal Resistance (θja) for AD664
BD-BIP. Is this parameter tested by some instrument or can it be calculate
through some equations?


AD664BD-BIP θJA = 50.9°C/W for 2 layer board in still air.The θJA spec is based
on a measurement.