We use in one of our product the AD53500 driver, and we notice that
these components produce a lot of heat in static mode that is to say
with a fixed voltage on the input.
We'd like to know if it corresponds to a normal operating or if it is
necessary to mount heat sink on these components.
More, it is possible to have thermal information about this chip.
AAD53500 is capable of producing a lot of heat, even in static conditions. The
device can produce up to 1.54W quiescent current + >2W (=180mA x 12V?) if the
output is shorted to -2V.
This is a lot of power! The junction-to-ambient thermal impedance is 49.1
degC/W (with some air moving over the part). Even with the quiescent power
dissipation of 1.54W the internal junction is about 75 Degrees above ambient
(dT = thJA x P = 49.1 x 1.54 = 75.6deg C)
So at room temperature of 25 deg, the internal junction temperature is at
At 50degC (typical of the inside of electronic equipment) the junction
temperature is 125 deg C
This is before you draw any current from the outputs. As you can see, the parts
run very hot. The package is a thermally enhanced SOIC to allow a heatsink to
be mounted. You might also consider using forced air cooling (a cooling fan).
The thermal information on the part is given on table II (page 4) of the