Thermal Analysis Data

Document created by analog-archivist Employee on Feb 23, 2016
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We are performing Thermal Analysis of a Board, we are using the following parts
AD5323BRU

We have the Theta Ja (Thermal Resistance junction to Ambient)

We need Theta jb (Thermal Resistance junction to Board) and  Theta jc (Thermal
Resistance junction to Case)

Please do the needful.

 

θJA Thermal Impedance  160°C/W

Junction Temperature (TJ Max)  150°C
16-Lead TSSOP Package
Power Dissipation  (TJ max − TA)/θJA


Theta-JA is Junction-to-air thermal resistance is a measure of the ability of a
device to dissipate heat from the surface of the die to the ambient via all
paths.

Theta-JC is junction to case thermal resistance is a measure of the ability of
a device to dissipate heat from the surface of the die to the top or bottom
surface of the package. It is applicable for packages used with external heat
sinks and only applies to situations where or nearly all of the heat is
dissipated through the surface in consideration. We do not have this
information available because Theta-JA information would suffice.

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