Q.
Is there information available on proper soldering and PCB assembly techniques for thermally enhanced packages?
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A.
Yes, see ADI application note AN-772, "A Design and Manufacturing Guide for the LFCSP". Information is also available on the website of the package manufacturer (Amkor Technology: www.amkor.com). Look for: "Application Notes For Surface Mount Assembly of Amkor's Thermally / Electrically Enhanced Leadframe Based Packages."
