Hello,
We have used AD7607 in one of our product & have done the functional testing at room temperature, everything works as designed, after successful functional test we went for ESS thermal cycling test which was successful . Now my product is in production phase. It has been observed that during the ESS ( thermal cycling ) phase the ADC gets damage. This is very random , because 70% of my production PCB which has sustain the thermal cycling but 30% of PCB has not, in both case production line is same no change at all. I am sharing the batch code one failed IC , AD7607-BSTZ-#2234 59347381 , the IC was procured using digikey distributor, qty purchase was *100 . We are now running pilot production batch . It would be great if some one from ADI reply immediately as we are in production phase.
Warm Regards
Gaurav
