AD7357WYRUZ-RL Tin Whisker Evaluation

I have a design which uses the AD7357WYRUZ-RL SAR ADC and need package information to do a Tin Whisker Analysis.

Can I get information such as:

   # Lead Finish Material

  #  Process (Electroplate, Immersion, Hot Dip)

   # Material Directly Beneath (brass, Cu, Fi, Ni, other)

  #  Substrate Controlling CTE (Ceramic, Low Expansion Alloy, Cu, Al, Fi, other)

  #  Is plating heated after deposition (No, Annealed, Fused)

Thank You!

Parents
  • LBOUKHANA677,


       # Lead Finish Material

      100% MATTE TIN


      #  Process (Electroplate, Immersion, Hot Dip)

      ELECTROPLATED


       # Material Directly Beneath (brass, Cu, Fi, Ni, other)

    COPPER

      #  Substrate Controlling CTE (Ceramic, Low Expansion Alloy, Cu, Al, Fi, other)

    Copper Alloy( Typically C7024, C7025, C194, or similar, depending on Vendor and Package)

      #  Is plating heated after deposition (No, Annealed, Fused) 

    Annealed (1 Hour @ 150'C within 24 Hours of Plating).

    Regards,


    Sean

Reply
  • LBOUKHANA677,


       # Lead Finish Material

      100% MATTE TIN


      #  Process (Electroplate, Immersion, Hot Dip)

      ELECTROPLATED


       # Material Directly Beneath (brass, Cu, Fi, Ni, other)

    COPPER

      #  Substrate Controlling CTE (Ceramic, Low Expansion Alloy, Cu, Al, Fi, other)

    Copper Alloy( Typically C7024, C7025, C194, or similar, depending on Vendor and Package)

      #  Is plating heated after deposition (No, Annealed, Fused) 

    Annealed (1 Hour @ 150'C within 24 Hours of Plating).

    Regards,


    Sean

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