The largest temp range the DAC will operate per the data sheet is -40 to +85 C. If I get the die will it operate at -55 to 125C? I will be mounting the die on ceramic substrate.
does the assumption that it will work if properly heatsunk although the die doesn''t consume much power or is it because LT/ADI doesn't characterize the part below -40 C?
We did not characterize or test to the higher/lower temperature because we did not see a market need. Because we haven’t looked at it we can’t comment on the performance at that temperature. Why not use this part which has 125degC operation? Doubt we’d release in die form.