deposited only on the center square of the exposed paddle PCB layout.
This is just a recommendation so that there is uniform solder flow under the
chip so there aren’t any “islands” that form when the chip is mounted on the
The partitioning can be done by using a solder mask layer. Figure 69 in the
shows an extreme case, but even if the area was partitioned into 4 areas, it
would still be better than having one big exposed paddle.