我想问一下，HMC7992数据手册的隔离度和损耗这些是指芯片本身还是测试板测试得到的，我做一个，测出来隔离度在-20dB以下，而数据手册上是-30dB，我测出来的最差损耗是在-3dB且在高频部分RF2和RF3的S11小于-7，RF1和RF4小于-10，而手册上是-1.4dB。我想问一下，我这个板子测出来的结果是合理的吗？还是我的板子布局有问题。用的基板是RO4350B，厚度是0.508mm
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