请问以下的芯片thermalpad 是否需要加过孔到gnd层呢,还是直接在top层直接连接到地网络

目前用到以下的电源芯片,请问以下的芯片thermalpad 是否需要加过孔到gnd层呢,还是直接在top层直接连接到地网络:

如果在thermalpad 上打过孔,应该打几个

 LT3042 : 封装是12-Lead Plastic DFN (3mm × 3mm)

 LT3650 : 封装是10-Lead Plastic DFN (3mm × 3mm)

LT3091:14-Lead Plastic DFN (4mm × 3mm)

LT3086 :  16-LEAD (5mm × 4mm) PLASTIC DFN

  • It is always best to connect the GND paddle to a GND plane through vias. This is necessary for good grounding as well as thermal dissipation.

    With DFN packages, some designs may work without vias on the GND paddle, but it is always recommended.

    Refer to the PCB layout recommendations in the datasheets.

    Regards,

    Zack