Category: Hardware
Product Number: MAX17703
请问MAX17703的PCB设计方案:方案1:用四层板,中间两层接地,PGND和GND不分割;方案二用两层板,PGND和GND不知道是否应分割单点相接还是不分割;这两个方案,哪个对EMI和性能更好?
请问MAX17703的PCB设计方案:方案1:用四层板,中间两层接地,PGND和GND不分割;方案二用两层板,PGND和GND不知道是否应分割单点相接还是不分割;这两个方案,哪个对EMI和性能更好?
__CommunityServer__Service__ - Moved from Battery Management System to Other Products (CN). Post date updated from Thursday, September 12, 2024 3:30 AM UTC to Thursday, September 12, 2024 3:30 AM UTC to reflect the move.
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