MAX96716AGTM/VY+T thermal design

Hello, 

I am a thermal engineer and I am interested in implementing MAX96716AGTM/VY+T GMSL in my PCB.

I went through the component's datasheet and could not find the following information:

1. Exposed pad dimensions (or even better, a mechanical drawing of the component).

2. Thermal resistance from junction to board.

3. It is also mentioned that the thermal resistance junction to case is 1°C/W. Is it the case top or bottom? If it is the case top then I am missing the case bottom resistance, and vise versa.

4. It is unclear what is the maximum junction temperature, is it -40°C to 105°C?

Thank you in advance,

Adi