在LTC6268-10芯片手册中,为了减小寄生反馈电容的影响,采用反馈电阻分流的方式减小寄生电容。
请问,在这种工作方式下,为了使寄生电容降到最低,对电路板的材料类型和厚度有什么要求吗?
在LTC6268-10芯片手册中,为了减小寄生反馈电容的影响,采用反馈电阻分流的方式减小寄生电容。
请问,在这种工作方式下,为了使寄生电容降到最低,对电路板的材料类型和厚度有什么要求吗?
Hi Tooooom33: I incorporated the wisdom on reducing feedback capacitance in Demo Board DC2414A. If you go to this site:
you will find the board design files. You can see the layouts and the board thicknesses and material (Nelco) in the various pdf drawings. There are 3 channels, one for higher speed at low Z, and two for optimized speed at high Z.
Hi Tooooom33: I incorporated the wisdom on reducing feedback capacitance in Demo Board DC2414A. If you go to this site:
you will find the board design files. You can see the layouts and the board thicknesses and material (Nelco) in the various pdf drawings. There are 3 channels, one for higher speed at low Z, and two for optimized speed at high Z.
Thanks a lot