在LTC6268-10芯片手册中，为了减小寄生反馈电容的影响，采用反馈电阻分流的方式减小寄生电容。
请问，在这种工作方式下，为了使寄生电容降到最低，对电路板的材料类型和厚度有什么要求吗？
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