SSM2211
Production
The SSM2211 is a high performance audio amplifier that delivers 1 W rms of low distortion audio power into a bridge-connected 8 O speaker load (or 1.5...
Datasheet
SSM2211 on Analog.com
Hi.
I have a question related to the package thermal resistance described in the SSM2211 datasheet.
(Data Sheet SSM2211 Rev. G | Page 6 of 24)
1)
Table 5.Thermal Resistance is listed as follows.
If you look closely, you will see that θJC is larger than θJA for the LFCSP package. This does not seem to be correct.
Also, I think the difference between θJA and θJC is too large for SOIC_N package.
I think there is some kind of typo.
I am sorry, but could you please confirm this?
2)
In Table 4, the upper limit of the Junction Temperature Range is listed as +165°C.
This does not seem to be consistent with the descriptions in other parts of the data sheet.
Could you please confirm this point as well?
Thank you in advance.
Unfortunately, we don’t have the product thermal data based on our records since 2018.
Theta JC on the product data sheet can be referred to Theta JC-top (not properly stated), it means that the thermal resistance is measured from the die hottest junction to the top of the package. Hence, the thermal resistance value on the datasheet is valid for LFCSP.
Regards,
Mae
Unfortunately, we don’t have the product thermal data based on our records since 2018.
Theta JC on the product data sheet can be referred to Theta JC-top (not properly stated), it means that the thermal resistance is measured from the die hottest junction to the top of the package. Hence, the thermal resistance value on the datasheet is valid for LFCSP.
Regards,
Mae