Question
1). Is the part suitable to be processed through a co-solvent cleaning process
after the devise is fitted/solder to a board in order to remove any flux
residues from the soldered connections?
2). The device seems to be potted with a black rubber compound … can you advise
on what potting material has been used?
3). How are the terminal pins connected to the internal PCB of the amplifier …
are there sprung or soldered contacts?
Answer
1). Is the part suitable to be processed through a co-solvent cleaning process
after the devise is fitted/solder to a board in order to remove any flux
residues from the soldered connections?
I would not recommend going through a cleaning process, these are not hermetic
components.
2). The device seems to be potted with a black rubber compound … can you advise
on what potting material has been used?
The soft material is a Silicone compound.
3). How are the terminal pins connected to the internal PCB of the amplifier …
are there sprung or soldered contacts?
The pins are soldered internally to the PCB.