Q:
How should I connect the back side of the die to TO-46 header as mentioned in the data sheet?
A:
The back of the MAX3658 TIA die is electrically isolated. It can be attached to a TO header using either conductive or non-conductive epoxy. Users need to bond the GND pad (#5 and #8) on top of the die to a ground, which is the TO header in this case.