I was wondering what the electrical differences were between the LFCSP and SOIC_N packages on the ADA4622-4. The size of the LFCSP package is elegant, but it also has an EPAD on it which should help with heat dissipation, right? Are there any other measurable performance benefits to using the LFCSP package?
The major benefits with the LFCSP over the SOIC package is the space savings and heat dissipation with the EPAD.
There is no known performance difference, since they share the same data sheet specifications.