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LT1167 Thermal Data (8-Lead SOIC)

Thread Summary

The user requested thermal resistance values for the LT1167 (8-Lead SOIC) beyond the junction to ambient value found in the datasheet. The support engineer provided Theta-JB = 236.84 C/W and Theta-JC(top) = 44.02 C/W, noting that other parameters would require thermal simulation data. The user expressed surprise at the high Theta-JB value, which exceeds typical Theta-JA values for similar packages.
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Category: Datasheet/Specs
Product Number: LT1167

Can you provide the thermal resistance values for LT1167 Thermal Data (8-Lead SOIC)?

  • Junction to Case (Top) Thermal Resistance
  • Junction to Board Thermal Resistance
  • Junction to Case (Bottom) Thermal Resistance
  • Junction to Case Thermal Characterization Parameter (Psi)
  • Junction to Board Thermal Characterization Parameter (Psi)

I was able to locate the junction to ambient in the datasheet, but not the other values.

Product Page: https://www.analog.com/en/products/lt1167.html

Datasheet: https://www.analog.com/media/en/technical-documentation/data-sheets/1167fc.pdf

8-Lead SOIC Drawing: https://mds.analog.com/api/public/content/05081610_G_SO8.pdf 

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  • I am surprised by how high that thetaJB value is. It is not common for a thetaJB value to exceed the thetaJA value for any package type, regardless of whether or not it should be top/bottom cooled.

    Since the datasheet was from linear tech (which I understand was acquired by analog), I took a peek at this old linear tech pdf of estiamted thetaJA/JC values for various package types. A section of that is copied as an image below. A thetaJB of 236.84 C/W exceeds the approximate thetaJA values from this old reference file too. 

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