In our design we require the Temperature Coefficient of the Resistor's Matching Ratio will be max 0.2ppm/°C ( "0.2ppm/°C Matching Temperature Drift" as per datasheet). That is the most important parameter in the design.
I can see in the Electrical Characteristics table (p.4 of the DS) there a set of additional parameters like "Resistors Matching Ratio - Moisture Resistance, -Thermal Shock/Hysteresis, -IR reflow, -Accelerated Shelf Life" in 2..10ppm ranges.
My question is how the "0.2ppm/°C Matching Temperature Drift" will be affected by all those factors? Especially after soldering?