LT5400 - Matching Ratio Temperature Drift - stability, different parameters

In our design we require the Temperature Coefficient of the Resistor's Matching Ratio will be max 0.2ppm/°C ( "0.2ppm/°C Matching Temperature Drift" as per datasheet). That is the most important parameter in the design.

I can see in the Electrical Characteristics table (p.4 of the DS) there a set of additional parameters like "Resistors Matching Ratio - Moisture Resistance, -Thermal Shock/Hysteresis, -IR reflow, -Accelerated Shelf Life" in 2..10ppm ranges.

My question is how the "0.2ppm/°C Matching Temperature Drift" will be affected by all those factors? Especially after soldering?

Thanks.

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  • 0
    •  Analog Employees 
    on Oct 23, 2019 12:13 AM

    The LT5400 0.2ppm/C matching is a typical number.  The max guaranteed is 1ppm/C.

    The IR Reflow (3 cycles) spec is <3ppm typical.   I believe the 1ppm/C matching tempco is still guaranteed.

    Don't compare the post shock etc specs to the tempco matching.  Rather, compare them to the initial matching, which at 0.01%, is actually 100ppm.

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  • 0
    •  Analog Employees 
    on Oct 23, 2019 12:13 AM

    The LT5400 0.2ppm/C matching is a typical number.  The max guaranteed is 1ppm/C.

    The IR Reflow (3 cycles) spec is <3ppm typical.   I believe the 1ppm/C matching tempco is still guaranteed.

    Don't compare the post shock etc specs to the tempco matching.  Rather, compare them to the initial matching, which at 0.01%, is actually 100ppm.

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