In our design we require the Temperature Coefficient of the Resistor's Matching Ratio will be max 0.2ppm/°C ( "0.2ppm/°C Matching Temperature Drift" as per datasheet). That is the most important parameter in the design.
I can see in the Electrical Characteristics table (p.4 of the DS) there a set of additional parameters like "Resistors Matching Ratio - Moisture Resistance, -Thermal Shock/Hysteresis, -IR reflow, -Accelerated Shelf Life" in 2..10ppm ranges.
My question is how the "0.2ppm/°C Matching Temperature Drift" will be affected by all those factors? Especially after soldering?
The LT5400 0.2ppm/C matching is a typical number. The max guaranteed is 1ppm/C.
The IR Reflow (3 cycles) spec is <3ppm typical. I believe the 1ppm/C matching tempco is still guaranteed.
Don't compare the post shock etc specs to the tempco matching. Rather, compare them to the initial matching, which at 0.01%, is actually 100ppm.
GlenBrisebois said: I believe the 1ppm/C matching tempco is still guaranteed.
That would be great. Thanks.