I am currently working with the AD8233 chip for the acquisition of ECG signals, I have previously used the AD8232. In order to improve the product and decrease the size of the PCB, I have chosen to use the AD8233. The problem I have is the following: The pitch between the balls of the AD8233 is 0.4mm, this means that there can be no tracks between its pins, therefore I must use vias in pad.I plan to use vias whose diameter is 8 mil. Now my PCB is 4 layers, my question is if I can use these vias in pad from the top layer to the bottom layer?
I am not very clear if this can be done, I have read a lot of the subject, but some recommend using blind vias that go from the top layer to the closest plane.I would appreciate if you can give me information on how to solve this problem with the layout of the AD8233.
Very useful your appreciation. I had reviewed both materials, but I could not understand clearly, reviewing the documentation of other manufacturers I could understand more clearly.In my case the AD8233 is in the Bottom layer place the microvias up to the vcc plane (layer 3), I use track of the 3 mils of width. And guiding me by the photos of the evaluation board I make the route of the signals.