Why is the layout of the PN:AD630SD/883B DC:2019+ wafer different from that of the datastheet when we order it?
This is the layout on the datasheet in the specification.
This is AD630SD/883 DC:2019+ by de-encapsulating the components, and the wafer layout can be seen visually as shown in the figure: (for example, a microscope with a magnification of 200X) de-encapsulate the assembly
As shown in the picture, the red mark is different from datasheet.
I would like to ask, why is the layout of the wafer different from that of the datasheet?
Does ADI have any information on this?
Can you provide me with the latest wafer layout?
Thank you very much.
I'm not seeing any difference. The pad connections are in the same place. What specific differences are you seeing?
I'm glad to hear from you.
Please take a look at these three pictures for me:
This is AD630SD/883 DC:2016+ by de-encapsulating the components, and the wafer layout can be seen visually as shown in the figure:
This is AD630SD/883 DC:2019+ by de-encapsulating the components, and the wafer layout can be seen visually as shown in the figure:
The DC:2016+ wafer layout is the same as Datasheet, but the DC:2019 wafer layout is a little different from Datasheet, which I marked in red.
I would like to ask:why is the layout of DC:2019+ wafers different from that of datasheet?
Does the ADI factory have any documentation on changing the wafer layout?
I look forward to hearing from you！
Then why did this happen? We are looking for an agent to purchase the products. How should we solve this problem?
But where did you get the water you are looking at??
You will need to go back to whoever you purchased these die from and ask them to start a Failure Analysis.
I downloaded a file on the ADI website. Can you help me to see if the original factory revised the AD630 design drawings on July 9, 18?
Thank you very much for your patient answer.
The attached PDF is the MIL version of the AD630 datasheet. It involves a documentation change. It also applies to packaged parts. You are packaging bare die into your own package, if I understand correctly.
AD630SCHIPS is the die only part number. PCN# 07-0092 from Mar/2008 is the last change (100mm to 150mm wafer).
So there has not been any changes to the die since 2008.