Why is the layout of the PN:AD630SD/883B DC:2019+ wafer different from that of the datastheet when we order it?
This is the layout on the datasheet in the specification.
This is AD630SD/883 DC:2019+ by de-encapsulating the components, and the wafer layout can be seen visually as shown in the figure: (for example, a microscope with a magnification of 200X) de-encapsulate the assembly
As shown in the picture, the red mark is different from datasheet.
I would like to ask, why is the layout of the wafer different from that of the datasheet?
Does ADI have any information on this?
Can you provide me with the latest wafer layout?
Thank you very much.
The attached PDF is the MIL version of the AD630 datasheet. It involves a documentation change. It also applies to packaged parts. You are packaging bare die into your own package, if I understand…
Which friends can help me answer this question?