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Wirebonding on EPAD (ADN2882)


I haven't found any application note about wirebonding on Exposed Pads ICs. I was looking for some information about the parameters used in the bonding process, like temperature, or the pressure that the needle makes on the pads.

Do you know something about this stuff? Or do you know where I can find some information (like application notes) about it?

Thank you,