I am calculating some lifetimes of electronic circuits using the MIL-STD-756B (one circuit includes the AD8058). AD provides some MTTF for their components (http://www.analog.com/en/about-adi/quality-reliability/reliability-data/wafer-fabrication-data.html) on wafer fabrication level.
Now I am not sure about the MTTF after packing as internal connections might also lead to failures. Do I need to add some terms?
Thanks for your help!
According to our reliability engineer, packaging and bonding of the device are not considered in determining the life of the part, and are thus, are not included in MTTF calculations. If you would like to check reliability data that is related to different packages, I recommend you check this link.
I hope this helps! Please let me know if you have any other questions.