1. We use AD2428 TDM format: TDM16, 48K, 32bit, TX0&TX1, RX0&RX1, TX1 for audio recoreding, BCLK=24.576Mhz. Our TDM PCB routing length is about 200mm. BCLK and SYNC as a PCB routing group. TXn as a PCB routing group. RXn as a PCB routing group. All TDM signals PCB routing length are controlled within 100mil. Each routing group is covered witch GND separately. PCB routing characteristic impedance is 50 ohm, Is this PCB routing ok for TDM16?
2. If I config the TDM timing with sigmal studio as below, and config the series resistance: BCLK with 100R, SYNC with 33R, TX1 with 33R, A2B can work normally for audio recording with TX1. If I config series resistance: BCLK with 33R, SYNC with 33R, TX1 with 33R, the audio recording is overamplitude and distortion. The test wave is as below. Can you explain the reason for this issue? Why I config DTXn changes on rising edge of BCLK through sigmal studio, but actual test is DTXn changes on falling edge?
Waveform comparison of SOC side, R1,R2,R3 wave marked are normal audio recorded waveform, and C wave marked is audio recorded overamplitude waveform, you can see when overamplitude, the TX1 Data delay to SYNC edge about one BCLK CLK.
3. If I config the TDM timing with sigmal studio as below, Configure different series resistance respectively: BCLK with 0R, 33R, 66R, 100R, SYNC with 0R, 33R,66R,100R, TX1 with 0R, 33R,66R,100R, the series resistance of BCLK, SYNC, TX1 is same all the time. A2B can work normally for audio recording with TX1. The test wave for 33R is as below. Why I config DTXn changes on rising edge of BCLK through sigmal studio, but actual test is DTXn changes on falling edge? What about the actual test wave with 33R for BCLK, SYNC, TX1?
This Figure is described as same polarity of BCLK, but also described as A2B_I2SCFG.TXBCLKINV ≠ A2B_I2SCFG.RXBCLKINV, is any error here?
AD2428 side wave(BCLK, SYNC, TX1 series resistance 33R) :
SOC side wave(BCLK, SYNC, TX1 series resistance 33R) :