there are two question need your help.
1、My current ad2428w bottom pad is all grounded, but I see that the data manual is divided into four areas of grounding. Is this design to slow down heat dissipation and facilitate welding?
2、I recently made the second version of PCB, and then proofed it out, and found that there was a problem with the TDM signal transmitted by ad2428w.
Our platform is Qualcomm + ad2428w. the master AD2428W -> output TDM signal to Qualcomm. I found that the TDM data and the clock were misaligned, and the downstream microphone data had no negative polarity data. It was only solved by adding a 33r resistor BCLK. When it was added to 133r, the waveform changed too much, which was close to a triangular wave. I knew very well that it was our PCB design problem, because there was no problem with the first version. Can you give us some suggestions on the hardware design of tdm16 or tdm32? At present, we want to know the reason to change the next version.
thanks a lot!