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Design Conference 2013

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Welcome to the Design Conference 2013 forum!

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Analog Devices, in partnership with Xilinx and MathWorks, is excited to present this series of free one-day technical training and exhibition events happening across the globe, starting in April.

 

Use the forum to get the latest updates on the sessions, demos, and to ask your questions. Guest bloggers from participating partners and sponsor companies will appear here as well.

US Design Conference Photos

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In this session at the Design Conference 2013, we will examine three important areas of test and measurement:

 

  1. High accuracy impedance measurement techniques
  2. MEMS-based dual axis tilt sensing
  3. Precision weigh scale signal conditioning

The impedance measurement section illustrates a solution to measuring both high and low values of complex impedances without the need for constant recalibration.

 

The tilt measurement section shows a modern application of low-g MEMS accelerometers and how dual axis devices provide increased accuracy over a full 360 degree range.

 

In the precision weigh scale section we will show how to process a load cell output with a 10mV full-scale range to greater than 15-bits of noise-free code resolution using the latest sigma-delta ADC technology. If you're confused by the terms "Noise-Free Resolution", "RMS Resolution", "Flicker Free Bits", "RMS Bits", and "ENOB" we'll clear that up for you also.

 

There will be demos available that illustrate the principles covered in all three topics.

 

Walt Kester

Staff Applications Engineer

Analog Devices

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Event Partners:

 

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Event Sponsors:

 

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Conference Schedule

North America

April 25: Boston, MA

April 30: Santa Clara, CA

 

Asia

May 22: Beijing, China

May 24: Shenzhen, China

 

Europe

June 18: Munich, Germany

June 20: Frankfurt, Germany